Myunghoi Kim, C. Yoon, Kyoungchoul Koo, C. Hwang, Hajin Sung, Joungho Kim
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Suppression of power/ground noise using meshed-planar electromagnetic bandgap (MP-EBG) structure for Ultra-Wideband (UWB) System-in-Package (SiP)
In this paper, we propose the meshed-planar electromagnetic bandgap (MP-EBG) structure with a meshed planar surface embedded in the package power plane to suppress a power/ground noise in the frequency range from 3.1GHz to 10.6GHz, also known as the frequency band of Ultra-Wideband (UWB). The MP-EBG structure has two different EBG surfaces. One surface is a mushroom-like surface embedded between a package power and a ground plane and the other surface is a meshed planar structure embedded in a package power plane. The MP-EBG structure enables to enhance the bandwidth of the stopband in the limited package area and achieve the 8.7GHz stop bandwidth with −30dB isolation.
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