{"title":"平$\\ mathm {Z}$ PCB配电网的去耦电容优化","authors":"H. Barnes, S. Sandler","doi":"10.1109/EMCSI.2018.8495286","DOIUrl":null,"url":null,"abstract":"Power integrity applications suffer from the inability to precisely define the dynamic transient current. This has led to an increased interest in designing for a target impedance over a wide spectral bandwidth. Prior art has shown that a flat impedance design results in the lowest m V ripple excursion per Amp of step load. [1] This paper provides a simple method for estimating the required decoupling C for flat impedance. This method is then used to demonstrate the adverse effect of inductance in the PDN that requires an increase in the required total decoupling capacitance.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Decoupling Capacitor Optimization for Flat $\\\\mathrm{Z}$ PCB Power Distribution Networks\",\"authors\":\"H. Barnes, S. Sandler\",\"doi\":\"10.1109/EMCSI.2018.8495286\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Power integrity applications suffer from the inability to precisely define the dynamic transient current. This has led to an increased interest in designing for a target impedance over a wide spectral bandwidth. Prior art has shown that a flat impedance design results in the lowest m V ripple excursion per Amp of step load. [1] This paper provides a simple method for estimating the required decoupling C for flat impedance. This method is then used to demonstrate the adverse effect of inductance in the PDN that requires an increase in the required total decoupling capacitance.\",\"PeriodicalId\":120342,\"journal\":{\"name\":\"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCSI.2018.8495286\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCSI.2018.8495286","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Decoupling Capacitor Optimization for Flat $\mathrm{Z}$ PCB Power Distribution Networks
Power integrity applications suffer from the inability to precisely define the dynamic transient current. This has led to an increased interest in designing for a target impedance over a wide spectral bandwidth. Prior art has shown that a flat impedance design results in the lowest m V ripple excursion per Amp of step load. [1] This paper provides a simple method for estimating the required decoupling C for flat impedance. This method is then used to demonstrate the adverse effect of inductance in the PDN that requires an increase in the required total decoupling capacitance.