充分防范大量可靠性缺陷的过程推动者和设计机会

L. Sheng
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引用次数: 0

摘要

我们同时解决了半导体可靠性工程中的两个主要挑战。一个是如何描述一个存在大量可靠性缺陷的基因缺陷部件。另一个是如何钝化所有的缺陷,以达到我们在该领域零故障的最终目标。本文重点介绍了长达十年的案例研究和对数百万集成电路出货量的跟踪。我们对缺陷的深刻描述已经使过程成熟并发现了一种新的可靠性设计(DfR)。相应的,缓解措施抑制了几个数量级的缺陷,并导致广大客户的零回报。此外,我们的集体方法承诺我们的零缺陷之路的叙述,天空是极限。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Process Enabler and Design Opportunities for Fully Safeguarding Against the Massive Presence of Reliability Defects
We have simultaneously addressed two major challenges in semiconductor reliability engineering. One is how to characterize a genetically defective component with a massive presence of reliability defects. The other is how to passivate all the defects for measuring up to our ultimate goal of zero failures in the field. This paper highlights a decade-long case study and follow-up on many millions of IC (integrated circuit) shipments. Our insightful characterizations of defects have enabled the process maturation and the discovery of a novel design-for-reliability (DfR). Correspondingly, the mitigating measures have suppressed defects by several orders of magnitude and resulted in zero returns from a broad range of customers. Furthermore, our collective approach promises the narrative of our Road to Zero Defects, where the sky is the limit.
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