Sn- 3ag /Cu和Sn/Cu接头在焊接和时效过程中金属间化合物层的生长行为

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Pub Date : 2006-06-27 DOI:10.1109/HDP.2006.1707604

Cong‐qian Cheng, Peng Yang, Jie Zhao, Feng Zhu, Qing-Yang Song

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引用次数: 1

摘要

研究了Sn- 3ag /Cu和Sn/Cu IMC层在焊接和时效过程中的生长行为。在焊接实验中，Sn- 3ag /Cu和Sn/Cu均在270℃下进行不同时间的焊接。在时效实验中，Sn- 3ag /Cu和Sn/Cu接头先在270℃下焊接60s，然后在120℃、170℃、190℃进行不同时间的时效处理。然后用扫描电子显微镜(SEM)对样品进行观察。采用Q500IW型图像分析仪测量IMC层的平均厚度。结果表明，在焊接过程中Sn- 3ag /Cu IMC层的生长速度要快于Sn/Cu的生长速度。时效过程中Sn- 3ag /Cu IMC层的生长速率低于Sn/Cu IMC层的生长速率。时效过程中Sn- 3ag /Cu和Sn/Cu IMC层的活化能分别约为90KJ/mol和52KJ/mol

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The growth behavior of intermetallic compound layers of Sn-3Ag / Cu and Sn/Cu joints during soldering and aging

The growth behaviors of Sn-3Ag/Cu and Sn/Cu IMC layers during soldering and aging have been investigated. In the soldering experiments, both the Sn-3Ag/Cu and Sn/Cu were soldered at 270 degC for different time. In the aging experiments, the Sn-3Ag/Cu and Sn/Cu joints were firstly soldered at 270 degC for 60s, and aged at 120 degC, 170 degC, 190 degC for various time. Then all the samples were observed under scanning electron microscopy (SEM). The average thickness of IMC layers was measured by using Q500IW image analysis meter. The results indicated that in the soldering the growth rate of Sn-3Ag/Cu IMC layers was faster than that of Sn/Cu. However, in the aging the growth rate of Sn-3Ag/Cu IMC layers was lower than that of Sn/Cu. The activation energies of Sn-3Ag/Cu and Sn/Cu IMC layers in the aging were about 90KJ/mol and 52KJ/mol respectively

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Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.

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