新颖的PCB制造工艺无粗糙度，适用于高频应用。

2015 12th International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE) Pub Date : 2015-12-17 DOI:10.1109/ICEEE.2015.7357904

Perez-Fajardo Abel, Torres-Jacome Alfonso, Torres-Torres Reydezel

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引用次数: 2

摘要

本文介绍了一种新的印刷电路板(PCB)制造工艺。它是迄今为止损耗最低的PCB制造工艺之一，适用于高频操作。采用等离子体工艺处理均匀且抛光的聚四氟乙烯表面作为衬底，而不是采用操纵表面来粘附金属。为了证明该提议的能力，构建了一个微带，并在20 GHz时产生了2 Np/m的衰减，损耗从s参数的测量中得到。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Novel PCB fabrication process roughness free for high frequency applications.

In this work, a new process for Print Circuit Board (PCB) fabrication is introduced. It is so far one of the lowest losses PCB fabrication process, for high frequency operation. Instead of a rigged surface for adhesion of the metal, a plasma process is used on homogeneous and polished surface of Teflon as substrate. For demonstrating the capability of this proposal, a microstrip is built and resulted with attenuation of a 2 Np/m at 20 GHz, loses were obtained from measurements from S-parameters.

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2015 12th International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE)

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