薄硅注入器(TSI):用于高密度电阻性RAM应用的全硅工程阻挡、高度非线性选择器

B. Govoreanu, Leqi Zhang, D. Crotti, Yang‐Shun Fan, V. Paraschiv, H. Hody, T. Witters, J. Meersschaut, S. Clima, C. Adelmann, M. Jurczak
{"title":"薄硅注入器(TSI):用于高密度电阻性RAM应用的全硅工程阻挡、高度非线性选择器","authors":"B. Govoreanu, Leqi Zhang, D. Crotti, Yang‐Shun Fan, V. Paraschiv, H. Hody, T. Witters, J. Meersschaut, S. Clima, C. Adelmann, M. Jurczak","doi":"10.1109/IMW.2015.7150309","DOIUrl":null,"url":null,"abstract":"We report on a novel Thin-Silicon Injector (TSI) selector concept with bidirectional operation for high density resistive switching memory. Model-based analysis shows how the current drive-nonlinearity trade-off can be broken by properly combining physical material properties to enable decoupling control parameters of the current injection from those of selectivity. We demonstrate experimentally structures down to 40nm-size, featuring a high-drive current of ~1MA/cm2, high current-voltage half-bias nonlinearity exceeding 6.103 at maximum current drive and very good reliability of >107cy endurance, with limited degradation of the selectivity. The selector has below 20nm thickness and it is fully implementable with readily available BEOL CMOS-compatible materials and processes.","PeriodicalId":107437,"journal":{"name":"2015 IEEE International Memory Workshop (IMW)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Thin-Silicon Injector (TSI): An All-Silicon Engineered Barrier, Highly Nonlinear Selector for High Density Resistive RAM Applications\",\"authors\":\"B. Govoreanu, Leqi Zhang, D. Crotti, Yang‐Shun Fan, V. Paraschiv, H. Hody, T. Witters, J. Meersschaut, S. Clima, C. Adelmann, M. Jurczak\",\"doi\":\"10.1109/IMW.2015.7150309\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We report on a novel Thin-Silicon Injector (TSI) selector concept with bidirectional operation for high density resistive switching memory. Model-based analysis shows how the current drive-nonlinearity trade-off can be broken by properly combining physical material properties to enable decoupling control parameters of the current injection from those of selectivity. We demonstrate experimentally structures down to 40nm-size, featuring a high-drive current of ~1MA/cm2, high current-voltage half-bias nonlinearity exceeding 6.103 at maximum current drive and very good reliability of >107cy endurance, with limited degradation of the selectivity. The selector has below 20nm thickness and it is fully implementable with readily available BEOL CMOS-compatible materials and processes.\",\"PeriodicalId\":107437,\"journal\":{\"name\":\"2015 IEEE International Memory Workshop (IMW)\",\"volume\":\"75 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-05-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Memory Workshop (IMW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMW.2015.7150309\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Memory Workshop (IMW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMW.2015.7150309","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

我们报道了一种新的双向操作的薄硅注入器(TSI)选择器概念,用于高密度电阻开关存储器。基于模型的分析表明,通过适当地结合材料的物理特性,使电流注入的控制参数与选择性参数解耦,可以打破电流驱动非线性权衡。我们在实验中展示了小至40nm尺寸的结构,具有~1MA/cm2的高驱动电流,在最大电流驱动时超过6.103的高电流-电压半偏置非线性和非常好的可靠性,>107cy续航时间,选择性退化有限。该选择器的厚度低于20nm,可与现成的BEOL cmos兼容材料和工艺完全实现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thin-Silicon Injector (TSI): An All-Silicon Engineered Barrier, Highly Nonlinear Selector for High Density Resistive RAM Applications
We report on a novel Thin-Silicon Injector (TSI) selector concept with bidirectional operation for high density resistive switching memory. Model-based analysis shows how the current drive-nonlinearity trade-off can be broken by properly combining physical material properties to enable decoupling control parameters of the current injection from those of selectivity. We demonstrate experimentally structures down to 40nm-size, featuring a high-drive current of ~1MA/cm2, high current-voltage half-bias nonlinearity exceeding 6.103 at maximum current drive and very good reliability of >107cy endurance, with limited degradation of the selectivity. The selector has below 20nm thickness and it is fully implementable with readily available BEOL CMOS-compatible materials and processes.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信