{"title":"电力装置高层注入区的状态变量建模——在电力系统仿真中的应用","authors":"B. Allard, H. Morel, J. Chante","doi":"10.1109/PESC.1992.254789","DOIUrl":null,"url":null,"abstract":"Modeling procedures that allow accurate simulations of power systems and predictions of electrical constraints endured by power devices are presented. Bond graph theory leads to a device modular analysis, and internal approximation allow state variable modeling of the high-level injection semiconductor layers. Applying these methods to the high-voltage power bipolar transistor gives good primary simulation results.<<ETX>>","PeriodicalId":402706,"journal":{"name":"PESC '92 Record. 23rd Annual IEEE Power Electronics Specialists Conference","volume":"75 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-06-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"State-variable modeling of high-level injection regions in power devices-application to power system simulation\",\"authors\":\"B. Allard, H. Morel, J. Chante\",\"doi\":\"10.1109/PESC.1992.254789\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Modeling procedures that allow accurate simulations of power systems and predictions of electrical constraints endured by power devices are presented. Bond graph theory leads to a device modular analysis, and internal approximation allow state variable modeling of the high-level injection semiconductor layers. Applying these methods to the high-voltage power bipolar transistor gives good primary simulation results.<<ETX>>\",\"PeriodicalId\":402706,\"journal\":{\"name\":\"PESC '92 Record. 23rd Annual IEEE Power Electronics Specialists Conference\",\"volume\":\"75 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-06-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"PESC '92 Record. 23rd Annual IEEE Power Electronics Specialists Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PESC.1992.254789\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"PESC '92 Record. 23rd Annual IEEE Power Electronics Specialists Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PESC.1992.254789","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
State-variable modeling of high-level injection regions in power devices-application to power system simulation
Modeling procedures that allow accurate simulations of power systems and predictions of electrical constraints endured by power devices are presented. Bond graph theory leads to a device modular analysis, and internal approximation allow state variable modeling of the high-level injection semiconductor layers. Applying these methods to the high-voltage power bipolar transistor gives good primary simulation results.<>