标准CMOS中的固态RF MEMS谐振器

Bichoy Bahr, R. Marathe, Wentao Wang, D. Weinstein
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引用次数: 3

摘要

本文综述了我们在CMOS- mems谐振器方面的工作,这些谐振器采用标准CMOS技术的前端线(FEOL)加工,无需后处理或特殊封装。在CMOS堆叠中发现由Si和SiO2组成的声学谐振器,由声学布拉格反射器限制,并使用嵌入声学谐振腔内的标准晶体管进行检测。讨论了MEMS谐振器高频有源晶体管传感的优点,从而得出了谐振体晶体管(rbt)的原理。采用IBM 32nm SOI工艺实现的rbt谐振频率在11 GHz以上,Q~30,占地面积小于15 μm2。最后,这些cmos集成器件的热稳定性显示为< 3 ppm/K。本文介绍的CMOS-MEMS谐振器为射频电路设计提供了构建模块,可以与片上时钟和信号处理的支持电路无缝集成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Solid state RF MEMS resonators in standard CMOS
This paper presents a review of our work in CMOS-MEMS resonators fabricated in Front-End-of-Line (FEOL) processing of standard CMOS technology with no need for post-processing or special packaging. Acoustic resonators composed of Si and SiO2 found in the CMOS stack are demonstrated, confined by Acoustic Bragg Reflectors and sensed using a standard transistor embedded inside the acoustic resonant cavity. The merits of active transistor sensing of MEMS resonators at high frequencies are discussed, leading to the principle of the Resonant Body Transistors (RBTs) described in this work. RBTs realized in IBM's 32nm SOI process are demonstrated with resonance frequency above 11 GHz and Q~30, spanning a footprint of less than 15 μm2. Finally, thermal stability of <;3 ppm/K is shown for these CMOS-integrated devices. The CMOS-MEMS resonators presented here offer building blocks for RF circuit design which can be integrated seamlessly with supporting circuits for on-chip clocking and signal processing.
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