{"title":"基于高阶模腔和槽线的基板集成magic-T","authors":"Peng Wu, S. Liao, Q. Xue","doi":"10.1109/APMC.2015.7413074","DOIUrl":null,"url":null,"abstract":"In this paper, a substrate integrated magic-T is presented and fabricated. It is based on the higher order mode cavity and buried slotline. The wideband transition of SIW TE20 mode is employed to realize the out-of-phase divider while the microstrip-to-slotline transition is used to realize the in-phase divider. The slot is etched on the top of the higher order mode cavity. The ground metal defects are buried inside the multilayer substrate, and thus, in practical applications, additional bolster is not required for the defected ground slot. It is convenient for the proposed magic-T to be integrated with other circuits.","PeriodicalId":269888,"journal":{"name":"2015 Asia-Pacific Microwave Conference (APMC)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A substrate integrated magic-T based on higher order mode cavity and slotline\",\"authors\":\"Peng Wu, S. Liao, Q. Xue\",\"doi\":\"10.1109/APMC.2015.7413074\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a substrate integrated magic-T is presented and fabricated. It is based on the higher order mode cavity and buried slotline. The wideband transition of SIW TE20 mode is employed to realize the out-of-phase divider while the microstrip-to-slotline transition is used to realize the in-phase divider. The slot is etched on the top of the higher order mode cavity. The ground metal defects are buried inside the multilayer substrate, and thus, in practical applications, additional bolster is not required for the defected ground slot. It is convenient for the proposed magic-T to be integrated with other circuits.\",\"PeriodicalId\":269888,\"journal\":{\"name\":\"2015 Asia-Pacific Microwave Conference (APMC)\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 Asia-Pacific Microwave Conference (APMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APMC.2015.7413074\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 Asia-Pacific Microwave Conference (APMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APMC.2015.7413074","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A substrate integrated magic-T based on higher order mode cavity and slotline
In this paper, a substrate integrated magic-T is presented and fabricated. It is based on the higher order mode cavity and buried slotline. The wideband transition of SIW TE20 mode is employed to realize the out-of-phase divider while the microstrip-to-slotline transition is used to realize the in-phase divider. The slot is etched on the top of the higher order mode cavity. The ground metal defects are buried inside the multilayer substrate, and thus, in practical applications, additional bolster is not required for the defected ground slot. It is convenient for the proposed magic-T to be integrated with other circuits.
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