快速热烧银膏的润湿性

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887551

P. Gierth, L. Rebenklau

{"title":"快速热烧银膏的润湿性","authors":"P. Gierth, L. Rebenklau","doi":"10.1109/ISSE.2014.6887551","DOIUrl":null,"url":null,"abstract":"Photovoltaic technology is evolving rapidly with new concepts and ideas to systematically improve module efficiency. Cell metallizations based on thick film pastes have to be fired less than one minute. It has already been shown that the solder interconnection of these rapid thermal firing pastes is critical in terms of wettability [1]. Main problems are solder leaching of commercially available pastes and paste adhesion to the silicon substrate. The correlation between paste composition and solder wettability has not been investigated yet. The aim of this work is to evaluate the wettability of rapid thermal firing pastes in dependence on paste composition and firing temperature. Pastes with spherical silver particles and lead free glass composition have been developed and fired with an industrial standard rapid thermal firing profile between (760...840) °C. Thick film surfaces and cross sections have been inspected. Solder wettability was evaluated with solder dip and solder reflow tests. Correlations between resulting thick films and their wetting or leaching characteristics have been investigated to improve the solder interconnection for rapid thermal firing solar cell metallizations.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Wettability of rapid thermal firing silver-Pastes\",\"authors\":\"P. Gierth, L. Rebenklau\",\"doi\":\"10.1109/ISSE.2014.6887551\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Photovoltaic technology is evolving rapidly with new concepts and ideas to systematically improve module efficiency. Cell metallizations based on thick film pastes have to be fired less than one minute. It has already been shown that the solder interconnection of these rapid thermal firing pastes is critical in terms of wettability [1]. Main problems are solder leaching of commercially available pastes and paste adhesion to the silicon substrate. The correlation between paste composition and solder wettability has not been investigated yet. The aim of this work is to evaluate the wettability of rapid thermal firing pastes in dependence on paste composition and firing temperature. Pastes with spherical silver particles and lead free glass composition have been developed and fired with an industrial standard rapid thermal firing profile between (760...840) °C. Thick film surfaces and cross sections have been inspected. Solder wettability was evaluated with solder dip and solder reflow tests. Correlations between resulting thick films and their wetting or leaching characteristics have been investigated to improve the solder interconnection for rapid thermal firing solar cell metallizations.\",\"PeriodicalId\":375711,\"journal\":{\"name\":\"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-05-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2014.6887551\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2014.6887551","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

光伏技术正以新的概念和思路迅速发展，以系统地提高组件效率。基于厚膜糊状物的电池金属化必须在一分钟内烧制。已经表明，这些快速热烧糊的焊料互连在润湿性方面是至关重要的[1]。主要问题是市售浆料的锡浸出和浆料与硅衬底的粘附。膏体成分与焊料润湿性之间的关系尚未得到研究。本工作的目的是评估快速热烧糊的润湿性取决于膏体成分和烧成温度。具有球形银颗粒和无铅玻璃成分的糊状物已经开发出来，并在(760…840)°C之间的工业标准快速热烧轮廓下烧制。已经检查了厚膜表面和横截面。通过浸锡和回流试验来评估焊锡的润湿性。研究了所产生的厚膜及其润湿或浸出特性之间的相关性，以改善快速热烧太阳能电池金属化的焊料互连。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Wettability of rapid thermal firing silver-Pastes

Photovoltaic technology is evolving rapidly with new concepts and ideas to systematically improve module efficiency. Cell metallizations based on thick film pastes have to be fired less than one minute. It has already been shown that the solder interconnection of these rapid thermal firing pastes is critical in terms of wettability [1]. Main problems are solder leaching of commercially available pastes and paste adhesion to the silicon substrate. The correlation between paste composition and solder wettability has not been investigated yet. The aim of this work is to evaluate the wettability of rapid thermal firing pastes in dependence on paste composition and firing temperature. Pastes with spherical silver particles and lead free glass composition have been developed and fired with an industrial standard rapid thermal firing profile between (760...840) °C. Thick film surfaces and cross sections have been inspected. Solder wettability was evaluated with solder dip and solder reflow tests. Correlations between resulting thick films and their wetting or leaching characteristics have been investigated to improve the solder interconnection for rapid thermal firing solar cell metallizations.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

自引率

0.00%

发文量