{"title":"薄氧化物CDM保护的验证技术","authors":"Mihaela-Daniela Dobre, P. Coll, G. Brezeanu","doi":"10.1109/CAS56377.2022.9934740","DOIUrl":null,"url":null,"abstract":"This paper describes a validation technique that permits the evaluation of the Charge Device Model Electrostatic Discharge (CDM-ESD) in case of long metal interconnection between driver-receiver pair. The problem statement and verification approach are illustrated. A fully defined method that will help the prevention of the CDM-ESD event, with emphasis on future steps to detect the failures for 28nm technology thin-oxide devices is reported.","PeriodicalId":380138,"journal":{"name":"2022 International Semiconductor Conference (CAS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Validation Technique for Thin Oxide CDM Protections\",\"authors\":\"Mihaela-Daniela Dobre, P. Coll, G. Brezeanu\",\"doi\":\"10.1109/CAS56377.2022.9934740\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes a validation technique that permits the evaluation of the Charge Device Model Electrostatic Discharge (CDM-ESD) in case of long metal interconnection between driver-receiver pair. The problem statement and verification approach are illustrated. A fully defined method that will help the prevention of the CDM-ESD event, with emphasis on future steps to detect the failures for 28nm technology thin-oxide devices is reported.\",\"PeriodicalId\":380138,\"journal\":{\"name\":\"2022 International Semiconductor Conference (CAS)\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-10-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Semiconductor Conference (CAS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CAS56377.2022.9934740\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Semiconductor Conference (CAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CAS56377.2022.9934740","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Validation Technique for Thin Oxide CDM Protections
This paper describes a validation technique that permits the evaluation of the Charge Device Model Electrostatic Discharge (CDM-ESD) in case of long metal interconnection between driver-receiver pair. The problem statement and verification approach are illustrated. A fully defined method that will help the prevention of the CDM-ESD event, with emphasis on future steps to detect the failures for 28nm technology thin-oxide devices is reported.