功率半导体封装热阻的实验研究

InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88 Pub Date : 1988-05-11 DOI:10.1109/ITHERM.1988.28675

G. Yuqin, W. Yajue

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引用次数: 3

摘要

讨论了一种测量封装材料特性参数和封装热阻(包括接触电阻)的实验方法。建立了基于一维分析和准稳态传导过程的物理模型。采用均匀强度的连续激光束作为热源。测定了铍陶瓷的热扩散率和封装热阻。研究结果可用于包装制造质量的检验。

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An experimental study of thermal resistance of a power semiconductor package

An experimental method for measuring packaging material characteristic parameters and the package thermal resistance including the contact resistance is discussed. The physical model based on one-dimensional analysis and the quasi-steady conduction process are developed. A continuous laser beam with uniform intensity is used as a heat source. The thermal diffusivity of beryllia ceramics and the package thermal resistance have been measured. The results can be applied to check the package manufacturing quality.<>

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InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88

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