{"title":"介绍了利用金刚石在多芯片功率模块(MCPM)的基础上驱动感应电机","authors":"K. Olejniczak, A. Malshe, V. Gumaste","doi":"10.1109/IAS.1998.730284","DOIUrl":null,"url":null,"abstract":"The unique combination of excellent thermal, electrical, and mechanical properties makes synthetic diamond a legitimate material candidate for thermal management strategies in integrated drive modules. Over the past several years, joint research programs between academe have resulted in substantial diamond synthesis and post-synthesis processing time and cost, This is largely attributed to major advances in diamond synthesis using chemical vapor deposition (CVD) techniques. In this paper, an overview of diamond synthesis and post-synthesis processing is presented followed by a comparison of thermal heat spreading efficacy of silicon and CVD-diamond substrates for power electronic applications.","PeriodicalId":321042,"journal":{"name":"Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"On the use of diamond in a multichip power module (MCPM) based induction motor drive\",\"authors\":\"K. Olejniczak, A. Malshe, V. Gumaste\",\"doi\":\"10.1109/IAS.1998.730284\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The unique combination of excellent thermal, electrical, and mechanical properties makes synthetic diamond a legitimate material candidate for thermal management strategies in integrated drive modules. Over the past several years, joint research programs between academe have resulted in substantial diamond synthesis and post-synthesis processing time and cost, This is largely attributed to major advances in diamond synthesis using chemical vapor deposition (CVD) techniques. In this paper, an overview of diamond synthesis and post-synthesis processing is presented followed by a comparison of thermal heat spreading efficacy of silicon and CVD-diamond substrates for power electronic applications.\",\"PeriodicalId\":321042,\"journal\":{\"name\":\"Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242)\",\"volume\":\"49 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-10-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IAS.1998.730284\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IAS.1998.730284","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
On the use of diamond in a multichip power module (MCPM) based induction motor drive
The unique combination of excellent thermal, electrical, and mechanical properties makes synthetic diamond a legitimate material candidate for thermal management strategies in integrated drive modules. Over the past several years, joint research programs between academe have resulted in substantial diamond synthesis and post-synthesis processing time and cost, This is largely attributed to major advances in diamond synthesis using chemical vapor deposition (CVD) techniques. In this paper, an overview of diamond synthesis and post-synthesis processing is presented followed by a comparison of thermal heat spreading efficacy of silicon and CVD-diamond substrates for power electronic applications.