用于电动汽车的大电流电源模块

K. Berringer, G. Romero
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引用次数: 5

摘要

本文讨论了适合电动汽车牵引电机驱动应用的电源模块技术的发展。这些模块必须具有大电流能力,低导通电压,低开关损耗,并能够承受大量的热循环。硅IGBT技术的进步显著改善了其导通电压和开关特性。最先进的100安培IGBT芯片的典型导通电压低于2.0伏。这种导通电压的降低允许在给定电流下使用更少的硅并提高效率。采用特殊设计的电路布局和引线结构,开发了一种低电感功率模块,以减少高速开关时的电压超调。在封装方面,金属基复合材料(MMC)技术已被用于在不牺牲热性能的情况下大大提高可靠性和设计灵活性。特别是碳化硅/铝(SiC/Al),一种可成型的MMC,其热膨胀系数可以定制,已被用于设计集成封装,与铜基功率模块相比,具有出色的可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High current power modules for electric vehicles
This paper discusses developments in power module technology suited for electric vehicle traction motor drive applications. These modules must have high current capability, low on-voltage, low switching losses, and be able to withstand a large number of thermal cycles. Advances in silicon IGBT technology has significantly improved their on-voltage and switching characteristics. The typical on-voltage for a state of the art 100 Amp IGBT die is under 2.0 volts. This reduction in on-voltage allows less silicon to be used for a given current and improves efficiency. A low inductance power module has been developed, using a specially designed circuit layout and lead structure, to reduce voltage overshoot during high speed switching. In terms of packaging, metal matrix composite (MMC) technology has been used to greatly improve reliability and design flexibility, without sacrificing thermal performance. In particular, silicon carbide/aluminum (SiC/Al), a moldable MMC whose thermal expansion coefficient can be tailored has been used to design integrated packages that have excellent reliability as compared to copper based power modules.
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