采用倒装片键合方法的硅微顶点检测器检测器单元的新结构和组装技术的发展

IEEE Conference on Nuclear Science Symposium and Medical Imaging Pub Date : 1992-10-25 DOI:10.1109/NSSMIC.1992.301207

Y. Saitoh, J. Yamanaka, H. Suzuki, S. Miyahara, M. Kamiya, K. Kadoi, T. Masusda, K. Maemura, M. Inoue, A. Suzuki, H. Takeuchi, M. Mandai, H. Kanazawa, Y. Higashi, H. Ikeda, S. Koike, T. Matsuda, H. Ozaki, M. Tanaka, T. Tsuboyama, S. Avrillon, S. Okuno, J. Haba, H. Hamai, S. Mori, K. Yusa

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引用次数: 3

摘要

为KEK B工厂建立了硅微顶点探测器单元的全尺寸模型。该模型由四个假的双面双金属硅微带探测器和两个在两侧安装假读出vlsi的硅端板组成。在本试验中，使用各向异性导电膜的倒装片键合方法应用于检测器单元的两侧，以50 μ m的间距键合640条条带。

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Development of novel architecture and assembly techniques for a detector unit for a silicon micro-vertex detector using the flip-chip bonding method

Full-size models of a detector unit for a silicon microvertex detector for the KEK B factory have been built. The model consists of four dummy double-sided, double-metal silicon microstrip detectors and two silicon end-boards mounted with dummy readout VLSIs on both sides. In this trial the flip-chip bonding method, using an anisotropic conductive film, is applied to both sides of the detector unit to bond 640 strips at a pitch of 50 mu m.<>

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IEEE Conference on Nuclear Science Symposium and Medical Imaging

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