The investigation of dry plasma technology in each steps for the fabrication of high performance redistribution layer

With the increasing demand for high-performance devices, the achievement of high-density package products become a crucial topic. However, the scale of semiconductor chips is difficult to miniature furthermore. Against this background, the technology of the semiconductor packages is focused to improve device performance. The package structure changes greatly depending on the intended use of the device. Thus, the process of miniaturizing the wiring layer is an important item to improve the performance of almost packaged products. This report describes plasma treatment for the fabrication of redistribution layer (RDL) using photosensitive polyimide (PI) by the dry ashing equipment with the method of surface wave plasma (SWP) and capacitively coupled plasma (CCP). In order to fabricate a high-performance RDL, it is necessary to control the surface situation of copper wiring, PI, and photoresist (PR) more delicately than ever before. In this paper, we report the survey results for each process to fabricate RDL.