磁性元件的封装工艺及其对元件功能的影响

Proceedings: Electrical Insulation Conference and Electrical Manufacturing and Coil Winding Conference (Cat. No.01CH37264) Pub Date : 2001-10-16 DOI:10.1109/EEIC.2001.965603

H. Arris

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引用次数: 2

摘要

桑迪亚国家实验室已经封装磁性元件超过40年。磁性组件组件的设计必须能够承受各种环境，然后正常工作，这取决于封装配方的适当使用。专门开发的材料加工参数在封装过程中往往至关重要，使我们能够提供高可靠性的磁性元件。本文讨论了我们几种用于磁性元件的配方的封装工艺参数。还讨论了影响组件功能的工艺偏差。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Encapsulation processes for magnetic components and their effect on component functionality

Sandia National Laboratories has been encapsulating magnetic components for over 40 years. The design of magnetic component assemblies that must withstand a variety of environments and then function correctly is dependent on the appropriate use of encapsulating formulations. Specially developed material processing parameters are often critical in the encapsulation process and enable us to provide high reliability magnetic components. This paper discusses encapsulation process parameters for several of our formulations utilized for magnetic components. Process deviations that affect component functionality are also discussed.

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Proceedings: Electrical Insulation Conference and Electrical Manufacturing and Coil Winding Conference (Cat. No.01CH37264)

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