SiO/ sub2 //HfO/ sub2 /介质中电荷俘获的表征

R. Degraeve, A. Kerber, E. Cartier, L. Pantisano, G. Groeseneken
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引用次数: 2

摘要

本文综述了表征HfO/sub - 2/电荷陷阱的技术。在HfO/ sub2 /层中存在缺陷带,位于Si导带上方。通过分别施加正极偏压或负极偏压,可以有效地对该带进行充电和放电。缺陷带的影响可以通过I/sub D/-V/sub G/特性来观察。实验结果表明,俘获过程由电子通量控制,而脱陷过程则由氧化场和晶格温度共同控制。电荷泵送被证明是测量SiO/sub - 2//HfO/sub - 2/堆中电荷俘获的一种合适的技术。通过改变栅极脉冲幅度或改变脉冲频率,可以在距离Si/SiO/sub - 2/接口的距离上扫描陷阱密度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characterization of charge trapping in SiO/sub 2//HfO/sub 2/ dielectrics
The techniques for characterizing HfO/sub 2/ charge traps are summarized in this paper. A defect band is present in the HfO/sub 2/ layer and located above the Si conduction band. This band can be efficiently charged and discharged by applying positive or negative gate bias respectively. The effect of the defect band can be observed by I/sub D/-V/sub G/ characteristic. It is concluded from experiments that only the electron fluence controls the trapping, while the detrapping is controlled by oxide field in combination with the lattice temperature. Charge pumping is proven to be a suitable technique to measure the charge trapping in SiO/sub 2//HfO/sub 2/ stacks. The trap density can be scanned by varying the gate pulse amplitude or in distance from the Si/SiO/sub 2/ interface by varying the pulse frequency.
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