受功耗限制的GSI芯片I/O互连总带宽上限

A. Naeemi, J. Meindl
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引用次数: 8

摘要

第一次估计了每个输入/输出位的平均能量耗散,这对于确定给定动态功率预算下芯片聚合I/O带宽的上限非常有用。一些经验参数,如租金参数和活度因子被用来捕捉芯片结构的影响。对于在45纳米技术节点上实现的投影多处理器,表明30tb /s是100W动态功耗下的最大聚合I/O带宽。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An upper limit for aggregate I/O interconnect bandwidth of GSI chips constrained by power dissipation
For the first time, the average energy dissipation per input/output bits is estimated, which is very useful in determining an upper bound for chip aggregate I/O bandwidth for a given dynamic power budget. Some empirical parameters such as Rent's parameters and activity factor are used to capture the impact of chip architecture. For a projected multiprocessor implemented at the 45 nm technology node it is shown that 30 Tb/s is the maximum aggregate I/O bandwidth for 100W dynamic power dissipation.
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