利用表面贴装光子技术的集成光学电路

IEEE Conference Avionics Fiber-Optics and Photonics, 2006. Pub Date : 2006-10-09 DOI:10.1109/AVFOP.2006.1707497

H. Blauvelt, A. Benzoni

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引用次数: 1

摘要

本文描述了表面贴装光子学(SMP)方法在光学元件中的应用。SMP采用硅元件制造的许多要素。SMP的关键要素包括使用CMOS代工厂进行平面光波电路(PLC)制造，有源III-V器件的晶圆级测试，使用无源对准的器件的倒装芯片键合，以及使用低成本的非密封塑料封装

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Integrated Optical Circuits Utilizing Surface Mount Photonics Technology

In this paper, the surface mount photonics (SMP) approach to optical components is described. SMP adopts many elements of silicon component manufacturing. Key elements of SMP include the use of CMOS foundries for planar lightwave circuit (PLC) fabrication, wafer scale testing of active III-V devices, flip chip bonding of devices using passive alignment, and the use of low cost non-hermetic plastic packaging

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IEEE Conference Avionics Fiber-Optics and Photonics, 2006.

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