{"title":"高密度光互连中具有回流兼容性的二维光纤阵列","authors":"T. Kumagai, H. Arao, H. Nguyen, T. Nakanishi","doi":"10.1364/ofc.2020.w2a.3","DOIUrl":null,"url":null,"abstract":"We developed a 2-dimensional fiber array (2D-FA) as an optical interconnection device for co-packaged optics. The 2D-FA was capable of maintaining a low connection loss of < 1.0 dB after reflow process at 260°C.","PeriodicalId":173355,"journal":{"name":"2020 Optical Fiber Communications Conference and Exhibition (OFC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"2-Dimentional Fiber Array with Reflow Compatibility for High-Density Optical Interconnection\",\"authors\":\"T. Kumagai, H. Arao, H. Nguyen, T. Nakanishi\",\"doi\":\"10.1364/ofc.2020.w2a.3\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We developed a 2-dimensional fiber array (2D-FA) as an optical interconnection device for co-packaged optics. The 2D-FA was capable of maintaining a low connection loss of < 1.0 dB after reflow process at 260°C.\",\"PeriodicalId\":173355,\"journal\":{\"name\":\"2020 Optical Fiber Communications Conference and Exhibition (OFC)\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 Optical Fiber Communications Conference and Exhibition (OFC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1364/ofc.2020.w2a.3\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 Optical Fiber Communications Conference and Exhibition (OFC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/ofc.2020.w2a.3","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
2-Dimentional Fiber Array with Reflow Compatibility for High-Density Optical Interconnection
We developed a 2-dimensional fiber array (2D-FA) as an optical interconnection device for co-packaged optics. The 2D-FA was capable of maintaining a low connection loss of < 1.0 dB after reflow process at 260°C.