易出错新兴存储器的高效刷洗机制

M. Awasthi, Manjunath Shevgoor, K. Sudan, B. Rajendran, R. Balasubramonian, V. Srinivasan
{"title":"易出错新兴存储器的高效刷洗机制","authors":"M. Awasthi, Manjunath Shevgoor, K. Sudan, B. Rajendran, R. Balasubramonian, V. Srinivasan","doi":"10.1109/HPCA.2012.6168941","DOIUrl":null,"url":null,"abstract":"Many memory cell technologies are being considered as possible replacements for DRAM and Flash technologies, both of which are nearing their scaling limits. While these new cells (PCM, STT-RAM, FeRAM, etc.) promise high density, better scaling, and non-volatility, they introduce new challenges. Solutions at the architecture level can help address some of these problems; e.g., prior research has proposed wear-leveling and hard error tolerance mechanisms to overcome the limited write endurance of PCM cells. In this paper, we focus on the soft error problem in PCM, a topic that has received little attention in the architecture community. Soft errors in DRAM memories are typically addressed by having SECDED support and a scrub mechanism. The scrub mechanism scans the memory looking for a single-bit error and corrects it before the line experiences a second uncorrectable error. However, PCM (and other emerging memories) are prone to new sources of soft errors. In particular, multi-level cell (MLC) PCM devices will suffer from resistance drift, that increases the soft error rate and incurs high overheads for the scrub mechanism. This paper is the first to study the design of architectural scrub mechanisms, especially when tailored to the drift phenomenon in MLC PCM. Many of our solutions will also apply to other soft-error prone emerging memories. We first show that scrub overheads can be reduced with support for strong ECC codes and a lightweight error detection operation. We then design different scrub algorithms that can adaptively trade-off soft and hard errors. Using an approach that combines all proposed solutions, our scrub mechanism yields a 96.5% reduction in uncorrectable errors, a 24.4 × decrease in scrub-related writes, and a 37.8% reduction in scrub energy, relative to a basic scrub algorithm used in modern DRAM systems.","PeriodicalId":380383,"journal":{"name":"IEEE International Symposium on High-Performance Comp Architecture","volume":"1117 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"106","resultStr":"{\"title\":\"Efficient scrub mechanisms for error-prone emerging memories\",\"authors\":\"M. Awasthi, Manjunath Shevgoor, K. Sudan, B. Rajendran, R. Balasubramonian, V. Srinivasan\",\"doi\":\"10.1109/HPCA.2012.6168941\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Many memory cell technologies are being considered as possible replacements for DRAM and Flash technologies, both of which are nearing their scaling limits. While these new cells (PCM, STT-RAM, FeRAM, etc.) promise high density, better scaling, and non-volatility, they introduce new challenges. Solutions at the architecture level can help address some of these problems; e.g., prior research has proposed wear-leveling and hard error tolerance mechanisms to overcome the limited write endurance of PCM cells. In this paper, we focus on the soft error problem in PCM, a topic that has received little attention in the architecture community. Soft errors in DRAM memories are typically addressed by having SECDED support and a scrub mechanism. The scrub mechanism scans the memory looking for a single-bit error and corrects it before the line experiences a second uncorrectable error. However, PCM (and other emerging memories) are prone to new sources of soft errors. In particular, multi-level cell (MLC) PCM devices will suffer from resistance drift, that increases the soft error rate and incurs high overheads for the scrub mechanism. This paper is the first to study the design of architectural scrub mechanisms, especially when tailored to the drift phenomenon in MLC PCM. Many of our solutions will also apply to other soft-error prone emerging memories. We first show that scrub overheads can be reduced with support for strong ECC codes and a lightweight error detection operation. We then design different scrub algorithms that can adaptively trade-off soft and hard errors. Using an approach that combines all proposed solutions, our scrub mechanism yields a 96.5% reduction in uncorrectable errors, a 24.4 × decrease in scrub-related writes, and a 37.8% reduction in scrub energy, relative to a basic scrub algorithm used in modern DRAM systems.\",\"PeriodicalId\":380383,\"journal\":{\"name\":\"IEEE International Symposium on High-Performance Comp Architecture\",\"volume\":\"1117 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-02-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"106\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE International Symposium on High-Performance Comp Architecture\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HPCA.2012.6168941\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE International Symposium on High-Performance Comp Architecture","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HPCA.2012.6168941","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 106

摘要

许多存储单元技术被认为是DRAM和闪存技术的可能替代品,这两种技术都接近其扩展极限。虽然这些新型电池(PCM、STT-RAM、FeRAM等)有望实现高密度、更好的可缩放性和非挥发性,但它们也带来了新的挑战。架构级别的解决方案可以帮助解决其中的一些问题;例如,先前的研究已经提出了磨损平衡和硬误差容限机制来克服PCM电池有限的写入耐力。本文主要研究PCM中的软误差问题,这是一个在架构界很少受到关注的话题。DRAM内存中的软错误通常通过具有SECDED支持和擦洗机制来解决。擦除机制扫描内存查找单个错误,并在该行遇到第二个不可纠正错误之前对其进行纠正。然而,PCM(和其他新兴存储器)容易产生新的软错误源。特别是,多级单元(MLC) PCM器件将遭受电阻漂移,这增加了软错误率,并导致擦洗机制的高开销。本文首次研究了结构擦洗机制的设计,特别是针对MLC PCM中的漂移现象进行了研究。我们的许多解决方案也适用于其他容易出现软错误的新兴存储器。我们首先展示了通过支持强ECC代码和轻量级错误检测操作可以减少擦洗开销。然后,我们设计了不同的擦洗算法,可以自适应地权衡软错误和硬错误。与现代DRAM系统中使用的基本刷洗算法相比,我们的刷洗机制将不可纠正错误减少了96.5%,与刷洗相关的写入减少了24.4倍,并减少了37.8%的刷洗能量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Efficient scrub mechanisms for error-prone emerging memories
Many memory cell technologies are being considered as possible replacements for DRAM and Flash technologies, both of which are nearing their scaling limits. While these new cells (PCM, STT-RAM, FeRAM, etc.) promise high density, better scaling, and non-volatility, they introduce new challenges. Solutions at the architecture level can help address some of these problems; e.g., prior research has proposed wear-leveling and hard error tolerance mechanisms to overcome the limited write endurance of PCM cells. In this paper, we focus on the soft error problem in PCM, a topic that has received little attention in the architecture community. Soft errors in DRAM memories are typically addressed by having SECDED support and a scrub mechanism. The scrub mechanism scans the memory looking for a single-bit error and corrects it before the line experiences a second uncorrectable error. However, PCM (and other emerging memories) are prone to new sources of soft errors. In particular, multi-level cell (MLC) PCM devices will suffer from resistance drift, that increases the soft error rate and incurs high overheads for the scrub mechanism. This paper is the first to study the design of architectural scrub mechanisms, especially when tailored to the drift phenomenon in MLC PCM. Many of our solutions will also apply to other soft-error prone emerging memories. We first show that scrub overheads can be reduced with support for strong ECC codes and a lightweight error detection operation. We then design different scrub algorithms that can adaptively trade-off soft and hard errors. Using an approach that combines all proposed solutions, our scrub mechanism yields a 96.5% reduction in uncorrectable errors, a 24.4 × decrease in scrub-related writes, and a 37.8% reduction in scrub energy, relative to a basic scrub algorithm used in modern DRAM systems.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信