聚苯胺复合薄膜的介电性能和电学性能

D. Mezdour, M. Tabellout, J. Bardeau, S. Sahli
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引用次数: 1

摘要

本文研究了用高分子核壳粒子制备薄膜的方法。我们的方法是基于透明聚合物(聚酰胺和聚苯乙烯)颗粒周围一层非常薄的聚苯胺(PANI)的化学聚合。然后将合成的两种核壳粉末分别溶解在二氯甲烷和间甲酚中得到薄膜。电学性质用介电弛豫光谱仪进行了研究。两种复合膜都表现出渗透行为和良好的直流导电性,这与聚苯胺跨越簇的导电性能有关。这种特性允许在半导体应用中使用这种薄膜。对于聚酰胺薄膜,在5 wt. %的聚苯胺中获得高介电常数,允许它们作为高k介电剂与有机印刷电路板兼容。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Dielectric and electrical properties of PANI composite films
The present work deals with the preparation of films from polymeric core-shell particles. Our approach is based on the chemical polymerization of a very thin layer of polyaniline (PANI) around particles of transparent polymers (polyamide and polystyrene). Films are then obtained by dissolving the two type synthesized core-shell powders in dichloromethane and m-Cresol respectively. Electrical properties were investigated using a dielectric relaxation spectrometer. Both composite films exhibited a percolative behaviour and a well established dc conductivity for high PANI concentration related to the conductive properties of the PANI spanning clusters. This property allows using such films in semi-conductive applications. For polyamide films, high dielectric constants were obtained at 5 wt. % of PANI allowing their use as high k-dielectrics compatibles with organic printed circuit boards.
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