结合封装与片上电网仿真的模型与分析

ISLPED'00: Proceedings of the 2000 International Symposium on Low Power Electronics and Design (Cat. No.00TH8514) Pub Date : 2000-08-01 DOI:10.1145/344166.344574

R. Panda, D. Blaauw, R. Chaudhry, V. Zolotov, B. Young, RaviKiran Ramaraju

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引用次数: 83

摘要

为了提高大型配电网暂态分析的准确性和效率，我们提出了新的建模和仿真技术。其中包括非开关器件固有去耦电容的精确模型，以及开关器件的统计开关电流模型。此外，还提出了三种新的仿真技术来减小问题的尺寸和加速问题。并给出了这些技术在三台PowerPC/sup TM微处理器上的应用结果。

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Model and analysis for combined package and on-chip power grid simulation

We present new modeling and simulation techniques to improve the accuracy and efficiency of transient analysis of large power distribution grids. These include an accurate model for the inherent decoupling capacitance of non-switching devices, as well as a statistical switching current model for the switching devices. Moreover, three new simulation techniques are presented for problem size-reduction and speed-up. Results of application of these techniques on three PowerPC/sup TM/ microprocessors are also presented.

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ISLPED'00: Proceedings of the 2000 International Symposium on Low Power Electronics and Design (Cat. No.00TH8514)

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