{"title":"可焊性测试仪图像处理分析单元的研制","authors":"D. Sankowski, K. Strzecha","doi":"10.1109/IMTC.2003.1208113","DOIUrl":null,"url":null,"abstract":"Absfrcrd In this paper problems which occurs during development of image processing and anaIysis unit for hightemperafure measurement system are presented Described vision unit were built especially for computerized sysiem for measurement of solderability by means of measure of the basic measurabIe quantifies characterizing interfaciaI interactions: the surface energy (suface tension) of the liquid phase and the exlreme weftability of the base with liquid","PeriodicalId":135321,"journal":{"name":"Proceedings of the 20th IEEE Instrumentation Technology Conference (Cat. No.03CH37412)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The development of image processing and analysis unit for building a solderability tester\",\"authors\":\"D. Sankowski, K. Strzecha\",\"doi\":\"10.1109/IMTC.2003.1208113\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Absfrcrd In this paper problems which occurs during development of image processing and anaIysis unit for hightemperafure measurement system are presented Described vision unit were built especially for computerized sysiem for measurement of solderability by means of measure of the basic measurabIe quantifies characterizing interfaciaI interactions: the surface energy (suface tension) of the liquid phase and the exlreme weftability of the base with liquid\",\"PeriodicalId\":135321,\"journal\":{\"name\":\"Proceedings of the 20th IEEE Instrumentation Technology Conference (Cat. No.03CH37412)\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 20th IEEE Instrumentation Technology Conference (Cat. No.03CH37412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMTC.2003.1208113\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 20th IEEE Instrumentation Technology Conference (Cat. No.03CH37412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMTC.2003.1208113","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The development of image processing and analysis unit for building a solderability tester
Absfrcrd In this paper problems which occurs during development of image processing and anaIysis unit for hightemperafure measurement system are presented Described vision unit were built especially for computerized sysiem for measurement of solderability by means of measure of the basic measurabIe quantifies characterizing interfaciaI interactions: the surface energy (suface tension) of the liquid phase and the exlreme weftability of the base with liquid