用MOD工艺制备的铁电0.2PZN-0.8PZT(53/47)厚膜

Xiyun He, Xinsen Zheng, P. Qiu, W. Cheng, A. Ding
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引用次数: 0

摘要

采用金属有机分解(MOD)法制备了厚达6.8 mum的无裂纹钙粘质0.2PZN-0.8PZT(53/47)薄膜。厚膜呈纯钙钛矿相结构,微观结构致密均匀。对该厚膜的介电、铁电和压电性能进行了测试和讨论。观察到一个完美的铁电P-E环。用标准柏林考特式测量仪测量了薄膜的有效压电系数d33,f。0.2PZN-0.8PZT(53/47)厚膜的d33,f值约为177 pC/N;大于相同条件下PZT(53/47)厚膜的98 pC/N。这种0.2PZN-0.8PZT(53/47)厚膜在微电子器件中具有良好的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Relaxor Ferroelectric 0.2PZN-0.8PZT(53/47) Thick Films Fabricated Using a MOD Process
Crack free peroviskite 0.2PZN-0.8PZT (53/47) thick films up to 6.8 mum were prepared by a metallic-organic decomposition (MOD) process on platinum coated titanium (Pt/Ti) foil substrates by a dipping coating technique. The thick film exhibits a pure perovskite phase structure with dense and uniform microstructure. The dielectric, ferroelectric and piezoelectric properties of the thick film have been examined and discussed. A perfect ferroelectric P-E loop was observed. The efficient piezoelectric coefficient d33,f of the film was estimated by a standard Berlincourt type meter. The measured d33,f value of the 0.2PZN-0.8PZT (53/47) thick film is about 177 pC/N; it is larger than that of the PZT (53/47) thick film examined in the same condition, 98 pC/N. This 0.2PZN-0.8PZT (53/47) thick film promises a good application in the microelectronic devices.
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