交联环氧树脂中尺度方法的热机械性能评定。初步结果

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI:10.1109/ESIME.2011.5765833

S. Tesarski, A. Wymyslowski, O. Holck

{"title":"交联环氧树脂中尺度方法的热机械性能评定。初步结果","authors":"S. Tesarski, A. Wymyslowski, O. Holck","doi":"10.1109/ESIME.2011.5765833","DOIUrl":null,"url":null,"abstract":"Usage of polymers materials in microelectronics and especially in packing is nowadays common. Polymer materials are used for example in case of encapsulation, underfills for flip chip, moulding compound, electrically or thermally conductive adhesive, flexible electronics, materials for Printed Circuits Board (PCB), etc.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach — Preliminary results\",\"authors\":\"S. Tesarski, A. Wymyslowski, O. Holck\",\"doi\":\"10.1109/ESIME.2011.5765833\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Usage of polymers materials in microelectronics and especially in packing is nowadays common. Polymer materials are used for example in case of encapsulation, underfills for flip chip, moulding compound, electrically or thermally conductive adhesive, flexible electronics, materials for Printed Circuits Board (PCB), etc.\",\"PeriodicalId\":115489,\"journal\":{\"name\":\"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-04-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2011.5765833\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2011.5765833","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

高分子材料在微电子领域，特别是在包装领域的应用已十分普遍。聚合物材料用于封装，倒装芯片的衬底填充物，成型化合物，导电或导热粘合剂，柔性电子产品，印刷电路板(PCB)材料等。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach — Preliminary results

Usage of polymers materials in microelectronics and especially in packing is nowadays common. Polymer materials are used for example in case of encapsulation, underfills for flip chip, moulding compound, electrically or thermally conductive adhesive, flexible electronics, materials for Printed Circuits Board (PCB), etc.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

自引率

0.00%

发文量