{"title":"利用电磁模拟器对三维封装进行建模","authors":"I. Kelander, A. Arslan, L. Hyvonen, S. Kangasmaa","doi":"10.1109/SPI.2004.1409046","DOIUrl":null,"url":null,"abstract":"This paper discusses the modeling of 3D electronic packages. A 3D model of a stacked die package solution is built and analyzed in a 3D electromagnetic (EM) simulation tool, and a lumped element RLC equivalent model is extracted. The challenges and possibilities of EM simulation are discussed. The parasitic components of the package are studied by analyzing the 3D model by parts. Strategies in specifying a Spice net list of the package model and its feasibility in circuit simulations are considered.","PeriodicalId":119776,"journal":{"name":"Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2004-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Modeling of 3D packages using EM simulators\",\"authors\":\"I. Kelander, A. Arslan, L. Hyvonen, S. Kangasmaa\",\"doi\":\"10.1109/SPI.2004.1409046\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses the modeling of 3D electronic packages. A 3D model of a stacked die package solution is built and analyzed in a 3D electromagnetic (EM) simulation tool, and a lumped element RLC equivalent model is extracted. The challenges and possibilities of EM simulation are discussed. The parasitic components of the package are studied by analyzing the 3D model by parts. Strategies in specifying a Spice net list of the package model and its feasibility in circuit simulations are considered.\",\"PeriodicalId\":119776,\"journal\":{\"name\":\"Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-05-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2004.1409046\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2004.1409046","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper discusses the modeling of 3D electronic packages. A 3D model of a stacked die package solution is built and analyzed in a 3D electromagnetic (EM) simulation tool, and a lumped element RLC equivalent model is extracted. The challenges and possibilities of EM simulation are discussed. The parasitic components of the package are studied by analyzing the 3D model by parts. Strategies in specifying a Spice net list of the package model and its feasibility in circuit simulations are considered.
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