焊料互连润湿预测及实验评价

S. Kang, D. Baldwin
{"title":"焊料互连润湿预测及实验评价","authors":"S. Kang, D. Baldwin","doi":"10.1109/ECTC.2002.1008328","DOIUrl":null,"url":null,"abstract":"A new analysis methodology to predict solder interconnect wetting is developed to reveal the causes of poor wetting during flip chip assembly and to provide solutions. The analysis methodology characterizes solder wetting as two different processes: the wetting dynamics of the solder contact line and the generation of the minimum energy surface of the molten solder. Surface Evolver is implemented to generate the surface shape of solder during wetting. Since there are no quantified dynamics models for solder materials, a solder wetting dynamics model is developed based on former wetting models proposed for other materials. The contact angle relaxation of spreading over time is measured in specially designed experimental setup for model development. As a result of experiment and model evaluation, a best wetting dynamics model is developed and the development of analysis methodology is completed. The study of reflow process parameter effects is ongoing.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Prediction of solder interconnects wetting and experimental evaluation\",\"authors\":\"S. Kang, D. Baldwin\",\"doi\":\"10.1109/ECTC.2002.1008328\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new analysis methodology to predict solder interconnect wetting is developed to reveal the causes of poor wetting during flip chip assembly and to provide solutions. The analysis methodology characterizes solder wetting as two different processes: the wetting dynamics of the solder contact line and the generation of the minimum energy surface of the molten solder. Surface Evolver is implemented to generate the surface shape of solder during wetting. Since there are no quantified dynamics models for solder materials, a solder wetting dynamics model is developed based on former wetting models proposed for other materials. The contact angle relaxation of spreading over time is measured in specially designed experimental setup for model development. As a result of experiment and model evaluation, a best wetting dynamics model is developed and the development of analysis methodology is completed. The study of reflow process parameter effects is ongoing.\",\"PeriodicalId\":285713,\"journal\":{\"name\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2002.1008328\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008328","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

开发了一种新的分析方法来预测焊料互连润湿,以揭示倒装芯片组装过程中润湿不良的原因并提供解决方案。分析方法将焊料润湿描述为两个不同的过程:焊料接触线的润湿动态和熔融焊料的最小能量表面的产生。实现了表面演化器来生成润湿过程中焊料的表面形状。由于目前还没有定量的钎料润湿动力学模型,本文在前人提出的其他材料润湿模型的基础上,建立了钎料润湿动力学模型。在为模型开发而专门设计的实验装置中,测量了接触角随时间扩散的松弛。通过实验和模型评价,建立了最佳润湿动力学模型,完成了分析方法的开发。对回流工艺参数影响的研究正在进行中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Prediction of solder interconnects wetting and experimental evaluation
A new analysis methodology to predict solder interconnect wetting is developed to reveal the causes of poor wetting during flip chip assembly and to provide solutions. The analysis methodology characterizes solder wetting as two different processes: the wetting dynamics of the solder contact line and the generation of the minimum energy surface of the molten solder. Surface Evolver is implemented to generate the surface shape of solder during wetting. Since there are no quantified dynamics models for solder materials, a solder wetting dynamics model is developed based on former wetting models proposed for other materials. The contact angle relaxation of spreading over time is measured in specially designed experimental setup for model development. As a result of experiment and model evaluation, a best wetting dynamics model is developed and the development of analysis methodology is completed. The study of reflow process parameter effects is ongoing.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信