ESD中集成通信接口的功能分析

Thomas Ungru, W. Wilkening, Steffen Walker, R. Negra
{"title":"ESD中集成通信接口的功能分析","authors":"Thomas Ungru, W. Wilkening, Steffen Walker, R. Negra","doi":"10.1109/EMCCOMPO.2015.7358343","DOIUrl":null,"url":null,"abstract":"This paper presents the analysis of effects and consequences of ESD on an operating integrated communication interface. We used a test structure for a differential bus module and observed its output signal behaviour under conducted ESD gun stress, to our knowledge for the first time. Measurements correlate to our simulations.","PeriodicalId":236992,"journal":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Functional analysis of an integrated communication interface during ESD\",\"authors\":\"Thomas Ungru, W. Wilkening, Steffen Walker, R. Negra\",\"doi\":\"10.1109/EMCCOMPO.2015.7358343\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the analysis of effects and consequences of ESD on an operating integrated communication interface. We used a test structure for a differential bus module and observed its output signal behaviour under conducted ESD gun stress, to our knowledge for the first time. Measurements correlate to our simulations.\",\"PeriodicalId\":236992,\"journal\":{\"name\":\"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)\",\"volume\":\"74 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCCOMPO.2015.7358343\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCCOMPO.2015.7358343","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

本文分析了静电放电对集成通信接口的影响和后果。我们使用了差分总线模块的测试结构,并首次观察了其在传导ESD枪应力下的输出信号行为。测量结果与我们的模拟相关联。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Functional analysis of an integrated communication interface during ESD
This paper presents the analysis of effects and consequences of ESD on an operating integrated communication interface. We used a test structure for a differential bus module and observed its output signal behaviour under conducted ESD gun stress, to our knowledge for the first time. Measurements correlate to our simulations.
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