开发了多层聚酰亚胺板表面多芯片模块的基础技术，增加了附加元件的安装密度，并使用修改的芯片集成电路，以组织微电子混合功能组件的生产

Proceedings of The 2nd International Conference on Satellite Communications Pub Date : 1996-09-23 DOI:10.1109/ICSC.1996.864268

G. Guskov, G.A. Blinov Butusov, V.A. Lobentsov, Y. Medvedev

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摘要

在聚酰亚胺基板上没有任何封装的LSI是一般MCM结构的透视版本，因为它们不仅提高了换向板的使用效率，而且可以通过拒绝传统封装和引线框架来实现高元件速度。

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Development of the base technology for surface multichipping modules on the multilayer polyimide boards having the increased mounting density of the add-on components and using modification 2 chip ic in order to organize production of the microelectronic hubrid functional assemblies

LSI's without any packge on the polyimide substrate are a perspective version of the general MCM construction, because they not only increase use efficiency of the commutation board, but allow to realize high element speed by refuse from traditional package and lead frame.

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Proceedings of The 2nd International Conference on Satellite Communications

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