{"title":"基于键合晶圆技术的570mhz电流反馈放大器设计","authors":"Taewon Jung","doi":"10.1109/SOUTHC.1996.535100","DOIUrl":null,"url":null,"abstract":"The design of a monolithic, DC to 570 MHz, fast settling, low distortion current feedback amplifier is described. The circuit is fabricated in a complementary bipolar, bonded wafer silicon on insulator (SOI) technology.","PeriodicalId":199600,"journal":{"name":"Southcon/96 Conference Record","volume":"89 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design of a 570 MHz current feedback amplifier on bonded wafer technology\",\"authors\":\"Taewon Jung\",\"doi\":\"10.1109/SOUTHC.1996.535100\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The design of a monolithic, DC to 570 MHz, fast settling, low distortion current feedback amplifier is described. The circuit is fabricated in a complementary bipolar, bonded wafer silicon on insulator (SOI) technology.\",\"PeriodicalId\":199600,\"journal\":{\"name\":\"Southcon/96 Conference Record\",\"volume\":\"89 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-06-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Southcon/96 Conference Record\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOUTHC.1996.535100\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Southcon/96 Conference Record","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOUTHC.1996.535100","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design of a 570 MHz current feedback amplifier on bonded wafer technology
The design of a monolithic, DC to 570 MHz, fast settling, low distortion current feedback amplifier is described. The circuit is fabricated in a complementary bipolar, bonded wafer silicon on insulator (SOI) technology.
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