系统分析并提出了基于人工智能的低频和甚低频天线电感和电容寄生衰减技术

Kate G. Francisco, R. Relano, Mike Louie C. Enriquez, Ronnie S. Concepcion, Jonah Jahara G. Baun, Adrian Genevie G. Janairo, R. R. Vicerra, A. Bandala, E. Dadios, J. Dungca
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引用次数: 4

摘要

地下设施无损测绘是地下成像技术的基本概念之一,对改善许多基础设施问题有很大贡献。它通过具有功能几何结构的电极与各种地面条件的电阻率测量相结合。由于电场的存在,可能会产生电磁噪声和干扰,并可能导致数据不准确。在这一点上,了解影响系统的不同因素及其影响是至关重要的,这是开发有效过滤和屏蔽机制的第一步。因此,本文讨论了寄生电感和电容对低频和甚低频天线性能的可能影响,并收集了各种优化方法,以及在不同研究出版物和期刊中发现的用于减轻电子系统中寄生元件的工具和软件。此外,还提供了一个基于人工智能的框架,作为开发寄生天线滤波器的第一步,该滤波器在地下成像单天线阵列中表现良好。遗传算法是为优化天线滤波器而提出的人工智能技术,通过考虑材料的电导率和厚度,提供最佳的材料组合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Systematic Analysis and Proposed AI-based Technique for Attenuating Inductive and Capacitive Parasitics in Low and Very Low Frequency Antennas
Non-destructive mapping of underground utilities is one of the fundamental concepts of subsurface imaging technology that has a great contribution to the improvement of many infrastructure concerns. It is incorporated with electrical resistivity measurement of various ground conditions through electrodes with functional geometric configuration. Due to the presence of an electrical field, electromagnetic noise and interference will likely occur and might cause inaccuracy of data. On that note, it is vital to understand the different factors affecting the system and its impact as the initial step in the development of an effective filtering and shielding mechanism. Thus, this paper discusses the possible impacts of parasitic inductance and capacitance affecting the performance of low and very low-frequency antennas, and the collection of various optimization methods as well as the tools and software used in the mitigation of parasitic elements in an electronics system found in different research publications and journals. Furthermore, an AI-based framework was also provided as an initial step in the development of a parasitic antenna filter that performs well for underground imaging single antenna array. Genetic algorithm is the AI technique proposed for the optimization of the antenna filter by providing the best combination of material by considering its conductivity and thickness.
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