{"title":"微电子用铍陶瓷的金属化","authors":"J. A. DeVore","doi":"10.1109/EIC.1977.7461916","DOIUrl":null,"url":null,"abstract":"Within the last decade and especially in the last two years, the use of beryllia as an electronic substrate material has risen dramatically. One reason for this has been the development of high power devices which require electrical isolation. Another reason has been the demand for high packaging densities. Both of these reflect a need to remove heat from the device efficiently.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Metallization of beryllia ceramics for microelectronic use\",\"authors\":\"J. A. DeVore\",\"doi\":\"10.1109/EIC.1977.7461916\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Within the last decade and especially in the last two years, the use of beryllia as an electronic substrate material has risen dramatically. One reason for this has been the development of high power devices which require electrical isolation. Another reason has been the demand for high packaging densities. Both of these reflect a need to remove heat from the device efficiently.\",\"PeriodicalId\":214025,\"journal\":{\"name\":\"1977 EIC 13th Electrical/Electronics Insulation Conference\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1977-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1977 EIC 13th Electrical/Electronics Insulation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EIC.1977.7461916\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1977 EIC 13th Electrical/Electronics Insulation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EIC.1977.7461916","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Metallization of beryllia ceramics for microelectronic use
Within the last decade and especially in the last two years, the use of beryllia as an electronic substrate material has risen dramatically. One reason for this has been the development of high power devices which require electrical isolation. Another reason has been the demand for high packaging densities. Both of these reflect a need to remove heat from the device efficiently.
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