prepix2:核心架构和结果

J. Hoff, A. Mekkaoui, D. Christian, S. Zimmerman, G. Cancelo, R. Yarema
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引用次数: 10

摘要

FPIX是为Tevatron的对撞光束实验设计的像素架构。迄今为止,它最重要的应用是BTeV实验。PreFPIX2是一款测试FPIX核心(即像素控制和读出架构)的芯片。该FPIX核心将与特定于特定实验的外围相匹配。早先的计划要求BTeV FPIX芯片采用硬核工艺设计。然而,深亚微米CMOS工艺已经以更低的成本和更高的可靠性证明了适当的辐射耐受性。因此,利用耐辐射设计技术,在0.25微米的工艺中制备了PreFPIX2。该体系结构从早期版本的FPIX经历了实质性的发展。最值得注意的是对列令牌传递方案和列结束逻辑的改进。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
PreFPIX2: core architecture and results
FPIX is a pixel architecture designed for colliding-beam experiments at the Tevatron. Its most important application to date is the BTeV experiment. PreFPIX2 is a chip designed to test the FPIX core, i.e. the pixel control and readout architecture. This FPIX core will be mated to a periphery specific to a particular experiment. Earlier plans called for the BTeV FPIX chip to be designed in a rad-hard process. However, deep-submicron CMOS processes have demonstrated appropriate radiation tolerance at a lower cost and with greater reliability. Therefore, PreFPIX2 has been fabricated in a 0.25 micron process utilizing radiation tolerant design techniques. The architecture has undergone substantial development from earlier versions of FPIX. Most notable are the improvements to the column token passing scheme and to the end-of-column logic.
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