32 nm部分耗尽和45 nm完全耗尽SOI器件的总电离剂量辐射响应

N. Rezzak, E. Zhang, D. Ball, M. Alles, T. D. Loveless, peixiong zhao, K. Rodbell
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引用次数: 17

摘要

在32 nm PD SOI器件中,tid引起的变化取决于器件的变化:低VT器件的泄漏量略有增加,高VT器件的变化可以忽略不计。模拟的TID对高k金属栅极栅功函数的灵敏度和相关的掺杂变化证实,体掺杂仍然很高,通常会减轻TID的灵敏度。初步环形振荡器测量显示没有可测量的变化,电源电流或频率与TID。特别设计的45 nm SOI FDSOI器件由于与BOX层的耦合而表现出明显的tid诱导VT位移。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Total-ionizing-dose radiation response of 32 nm partially and 45 nm fully-depleted SOI devices
TID-induced changes in 32 nm PD SOI devices depend on the device variant: low VT devices show minor increased in leakage, high VT devices show negligible change. Simulated sensitivity of TID to the gate work function of the high-k metal gate and associated doping changes confirm that the body doping remains high and generally mitigates TID sensitivity. Preliminary ring oscillator measurements show no measurable change in supply current or frequency with TID. Specially designed experimental 45 nm SOI FDSOI devices exhibit a pronounced TID-induced VT shift due to the coupling with the BOX layer.
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