Y. Matsuda, T. Takai, Y. Okada, P. Lall, C. Koehler, T. Tessier, D. Olsen
{"title":"基于层压的倒装芯片芯片级封装可靠性研究","authors":"Y. Matsuda, T. Takai, Y. Okada, P. Lall, C. Koehler, T. Tessier, D. Olsen","doi":"10.1109/IEMTIM.1998.704506","DOIUrl":null,"url":null,"abstract":"The just about chip size package (JACS-Pak) design was developed for portable product applications. The package elements are solder bumped die, an epoxy underfill resin with inorganic filler, a low cost double-sided, semi-rigid epoxy glass or flex substrate, and solder ball terminals. This paper focuses on the board level reliability of the JACS-Pak package and benchmarks it with respect to standard ball grid array (BGA) packages, such as the glob top-BGA (GT-BGA) and the over molded pad array carrier (OMPAC). The samples (packages solder reflow attached to PCBs) are subjected to the liquid-to-liquid thermal shock testing from -55 to 125/spl deg/C at a rate of 5.8 cycles per hour. The results are compared to the thermal fatigue performance of standard 196 I/O GT-BGA and the 1.5 mm pitch OMPAC package. In addition, temperature cycling, temperature-humidity bias (THB), high temperature storage life (HTSL), and autoclave reliability tests were performed on the JACS-Pak package with excellent results.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Reliability study of the laminate-based flip-chip chip scale package\",\"authors\":\"Y. Matsuda, T. Takai, Y. Okada, P. Lall, C. Koehler, T. Tessier, D. Olsen\",\"doi\":\"10.1109/IEMTIM.1998.704506\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The just about chip size package (JACS-Pak) design was developed for portable product applications. The package elements are solder bumped die, an epoxy underfill resin with inorganic filler, a low cost double-sided, semi-rigid epoxy glass or flex substrate, and solder ball terminals. This paper focuses on the board level reliability of the JACS-Pak package and benchmarks it with respect to standard ball grid array (BGA) packages, such as the glob top-BGA (GT-BGA) and the over molded pad array carrier (OMPAC). The samples (packages solder reflow attached to PCBs) are subjected to the liquid-to-liquid thermal shock testing from -55 to 125/spl deg/C at a rate of 5.8 cycles per hour. The results are compared to the thermal fatigue performance of standard 196 I/O GT-BGA and the 1.5 mm pitch OMPAC package. In addition, temperature cycling, temperature-humidity bias (THB), high temperature storage life (HTSL), and autoclave reliability tests were performed on the JACS-Pak package with excellent results.\",\"PeriodicalId\":260028,\"journal\":{\"name\":\"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-04-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMTIM.1998.704506\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMTIM.1998.704506","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability study of the laminate-based flip-chip chip scale package
The just about chip size package (JACS-Pak) design was developed for portable product applications. The package elements are solder bumped die, an epoxy underfill resin with inorganic filler, a low cost double-sided, semi-rigid epoxy glass or flex substrate, and solder ball terminals. This paper focuses on the board level reliability of the JACS-Pak package and benchmarks it with respect to standard ball grid array (BGA) packages, such as the glob top-BGA (GT-BGA) and the over molded pad array carrier (OMPAC). The samples (packages solder reflow attached to PCBs) are subjected to the liquid-to-liquid thermal shock testing from -55 to 125/spl deg/C at a rate of 5.8 cycles per hour. The results are compared to the thermal fatigue performance of standard 196 I/O GT-BGA and the 1.5 mm pitch OMPAC package. In addition, temperature cycling, temperature-humidity bias (THB), high temperature storage life (HTSL), and autoclave reliability tests were performed on the JACS-Pak package with excellent results.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
