具有ITkPixV1读出芯片的第一个预生产3D FBK传感器的鉴定

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022) Pub Date : 2023-03-13 DOI:10.22323/1.420.0025

M. Ressegotti, G. Calderini, F. Crescioli, G. Dalla Betta, G. Gariano, C. Gemme, F. Guescini, S. Hadzic, T. Heim, A. Lapertosa, S. Ravera, A. Rummler, M. Samy, L. Vannoli, D. Sultan

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引用次数: 0

摘要

ITk探测器是用于高亮度大型强子对撞机(HL-LHC)的新型ATLAS硅跟踪系统，将在最内层(L0)配备3D像素传感器模块。筒体的像素单元尺寸为25 × 100 μ m 2，端盖的像素单元尺寸为50 × 50 μ m 2，每个像素的中心有一个读出电极，角落有四个偏置电极。FBK生产的预生产晶圆(50 × 50 μ m 2)的传感器已与IZM的ITkPixV1.1芯片碰撞结合。裸模块已经在热那亚的单芯片卡(SCCs)上组装，并在实验室测量和测试光束运动中进行了表征。其中一些模组已在波恩和欧洲核子研究中心辐照研究中心设施照射过。辐照后表征的初步结果

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Qualification of the first pre-production 3D FBK sensors with ITkPixV1 readout chip

The ITk detector, the new ATLAS silicon tracking system for the High Luminosity LHC (HL-LHC), will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be 25 × 100 µ m 2 in the barrel and 50 × 50 µ m 2 in the end-caps, with one readout electrode at the centre of each pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50 × 50 µ m 2 ) produced by FBK have been bump-bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards (SCCs) and characterized in laboratory measurements and in test beam campaigns. Some of these modules have been irradiated in Bonn and at the CERN IRRAD facility. Preliminary results of their characterization after irradiation

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Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)

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