用于三维光子电路的垂直堆叠SOI波导

3rd IEEE International Conference on Group IV Photonics, 2006. Pub Date : 2006-10-09 DOI:10.1109/GROUP4.2006.1708169

C. Brooks, J. Doylend, A. Knights, P. Jessop

{"title":"用于三维光子电路的垂直堆叠SOI波导","authors":"C. Brooks, J. Doylend, A. Knights, P. Jessop","doi":"10.1109/GROUP4.2006.1708169","DOIUrl":null,"url":null,"abstract":"We present a fabrication process for vertically-stacked SOI waveguides using spin-on-glass bonding to process individual layers. Simulations have shown that complete power transfer between 5 mum thick waveguides requires a 1.4 mm coupling length","PeriodicalId":342599,"journal":{"name":"3rd IEEE International Conference on Group IV Photonics, 2006.","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Vertically-Stacked SOI Waveguides for 3-D Photonic Circuits\",\"authors\":\"C. Brooks, J. Doylend, A. Knights, P. Jessop\",\"doi\":\"10.1109/GROUP4.2006.1708169\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present a fabrication process for vertically-stacked SOI waveguides using spin-on-glass bonding to process individual layers. Simulations have shown that complete power transfer between 5 mum thick waveguides requires a 1.4 mm coupling length\",\"PeriodicalId\":342599,\"journal\":{\"name\":\"3rd IEEE International Conference on Group IV Photonics, 2006.\",\"volume\":\"53 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"3rd IEEE International Conference on Group IV Photonics, 2006.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GROUP4.2006.1708169\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"3rd IEEE International Conference on Group IV Photonics, 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GROUP4.2006.1708169","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

我们提出了一种垂直堆叠SOI波导的制造工艺，使用玻璃自旋键合来处理各个层。仿真结果表明，5 μ m厚波导之间的完全功率传输需要1.4 mm的耦合长度

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Vertically-Stacked SOI Waveguides for 3-D Photonic Circuits

We present a fabrication process for vertically-stacked SOI waveguides using spin-on-glass bonding to process individual layers. Simulations have shown that complete power transfer between 5 mum thick waveguides requires a 1.4 mm coupling length

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3rd IEEE International Conference on Group IV Photonics, 2006.

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