栅极绝缘体对反通道蚀刻非晶锌锡氧化物薄膜晶体管电性能的影响

Hongyang Zuo, Letao Zhang, Yukun Yang, Changhui Fan, Shengdong Zhang
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引用次数: 0

摘要

采用不同厚度和沉积速率的栅极绝缘体(GI)制备了反通道刻蚀非晶锌锡氧化物薄膜晶体管(a-ZTO TFTs)。随着GI厚度的减小,器件表现出更高的场效应迁移率和更好的电应力稳定性。此外,由于GI表面光滑,沉积速度较慢,可以提高场效应迁移率和电应力稳定性。此外,结合渗流理论,我们提出了一个ZTO载流子输运模型来解释实验现象。优化后的器件具有良好的电学性能:适度的饱和迁移率为10 cm2/Vs,开/关比> 108,亚阈值摆幅为0.60V/dec。负、正Vgs作用下的Vth位移分别为- 0.28V和+0.17V。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Gate Insulator Influences on the Electrical Performance of Back-Channel-Etch Amorphous Zinc Tin Oxide (a-ZTO) Thin Film Transistors
Back-channel-etch amorphous zinc tin oxide thin film transistors (a-ZTO TFTs) are fabricated with various thicknesses and deposition rates of gate insulator (GI). The devices exhibit a higher field-effect mobility and better electrical stress stability with GI thickness decreasing. Furthermore, field-effect mobility and electrical stress stability can be improved by slow GI deposition rate, caused by smoother GI surface. Moreover, combining with percolation theory, we propose a ZTO carrier transport model to explain the experimental phenomenon. The optimized device exhibits good electrical performances: modest saturation mobility of 10 cm2/Vs, on/off ratio > 108 and subthreshold swing of 0.60V/dec. Besides, Vth shift under negative and positive Vgs is −0.28V and +0.17V, respectively.
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