III/V-on-bulk-Si平台:为DRAM而生，移植到LiDAR

2021 European Conference on Optical Communication (ECOC) Pub Date : 2021-09-13 DOI:10.1109/ecoc52684.2021.9605700

Dongjae Shin, H. Byun, Dongshik Shim, J. Cha, Yonghwack Shin, C. Shin, Chang-Bum Lee, Eunkyung Lee, Jisan Lee, Inoh Hwang, Kyunghyun Son, H. Choo, K. Ha

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引用次数: 1

摘要

我们概述了III/V-on-bulk-Si平台及其关键工艺、器件库、可行性和应用前景，并与III/V-on-SOI平台进行了比较。本文介绍了我们将光子集成到65纳米DRAM中的试验，在体硅平台上的激光开发，以及激光雷达应用的电路和系统开发。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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III/V-on-bulk-Si Platform: Born for DRAM, Transplanted to LiDAR

We overview the III/V-on-bulk-Si platform with its key process, device library, feasibility, and outlook for its applications along with its comparison to III/V-on-SOI platform. Our trial on integrating photonics into 65-nm DRAM, laser development on the bulk-Si platform, and circuit and system developments for LiDAR applications are presented.

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2021 European Conference on Optical Communication (ECOC)

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