下填料颗粒对倒装芯片互连可靠性的影响

Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268) Pub Date : 1997-10-26 DOI:10.1109/PEP.1997.656501

K. Darbha, J. Okura, A. Dasgupta

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引用次数: 34

摘要

通过参数分析研究倒装片焊料互连的可靠性是否受到下填料不均匀性的影响，如填料颗粒的沉降。用微力学公式模拟了填料沉降引起的性能分级。然后将预测的性能梯度用于倒装芯片组装的有限元模拟，以评估对焊料互连可靠性的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Impact of underfill filler particles on reliability of flip chip interconnects

Parametric analytical studies are conducted to investigate whether the reliability of flip chip solder interconnects are affected by underfill inhomogeneities, such as settling of the filler particles. The property gradation caused by filler settling is modelled with a micromechanical formulation. The predicted property gradients are then utilized in a finite element simulation of the flip chip assembly, to assess the impact on solder interconnect reliability.

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Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)

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