3D集成的新挑战和机遇

2015 IEEE International Electron Devices Meeting (IEDM) Pub Date : 2015-12-01 DOI:10.1109/IEDM.2015.7409655

J. Michailos, P. Coudrain, A. Farcy, N. Hotellier, S. Chéramy, S. Lhostis, E. Deloffre, Y. Sanchez, A. Jouve, F. Guyader, E. Saugier, V. Fiori, P. Vivet, M. Vinet, C. Fenouillet-Béranger, F. Casset, P. Batude, F. Breuf, Y. Henrion, B. Vianne, L. Collin, J. Colonna, L. Benaissa, L. Brunet, R. Prieto, R. Vélard, F. Ponthenier

{"title":"3D集成的新挑战和机遇","authors":"J. Michailos, P. Coudrain, A. Farcy, N. Hotellier, S. Chéramy, S. Lhostis, E. Deloffre, Y. Sanchez, A. Jouve, F. Guyader, E. Saugier, V. Fiori, P. Vivet, M. Vinet, C. Fenouillet-Béranger, F. Casset, P. Batude, F. Breuf, Y. Henrion, B. Vianne, L. Collin, J. Colonna, L. Benaissa, L. Brunet, R. Prieto, R. Vélard, F. Ponthenier","doi":"10.1109/IEDM.2015.7409655","DOIUrl":null,"url":null,"abstract":"From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high densities hybrid bonding or 3D VSLI CoolCubeTM solutions, a multitude of new product opportunities is now envisioned. An overview of existing emerging 3D integrations is provided covering Image sensors, Photonics, MEMS, Wide I/O memories and Silicon Interposers for advanced logics. Associated key challenges and developments are highlighted focusing on 3D platform performance assessment.","PeriodicalId":336637,"journal":{"name":"2015 IEEE International Electron Devices Meeting (IEDM)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"New challenges and opportunities for 3D integrations\",\"authors\":\"J. Michailos, P. Coudrain, A. Farcy, N. Hotellier, S. Chéramy, S. Lhostis, E. Deloffre, Y. Sanchez, A. Jouve, F. Guyader, E. Saugier, V. Fiori, P. Vivet, M. Vinet, C. Fenouillet-Béranger, F. Casset, P. Batude, F. Breuf, Y. Henrion, B. Vianne, L. Collin, J. Colonna, L. Benaissa, L. Brunet, R. Prieto, R. Vélard, F. Ponthenier\",\"doi\":\"10.1109/IEDM.2015.7409655\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high densities hybrid bonding or 3D VSLI CoolCubeTM solutions, a multitude of new product opportunities is now envisioned. An overview of existing emerging 3D integrations is provided covering Image sensors, Photonics, MEMS, Wide I/O memories and Silicon Interposers for advanced logics. Associated key challenges and developments are highlighted focusing on 3D platform performance assessment.\",\"PeriodicalId\":336637,\"journal\":{\"name\":\"2015 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2015.7409655\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2015.7409655","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 12

摘要

从低密度3D集成嵌入通过最后通过硅孔(TSV)到高密度混合键合或3D VSLI CoolCubeTM解决方案，现在设想了许多新产品的机会。概述了现有的新兴3D集成，涵盖图像传感器，光子学，MEMS，宽I/O存储器和用于先进逻辑的硅中间层。相关的关键挑战和发展重点是3D平台的性能评估。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

New challenges and opportunities for 3D integrations

From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high densities hybrid bonding or 3D VSLI CoolCubeTM solutions, a multitude of new product opportunities is now envisioned. An overview of existing emerging 3D integrations is provided covering Image sensors, Photonics, MEMS, Wide I/O memories and Silicon Interposers for advanced logics. Associated key challenges and developments are highlighted focusing on 3D platform performance assessment.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2015 IEEE International Electron Devices Meeting (IEDM)

自引率

0.00%

发文量