自适应光纤模块用高分子材料

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI:10.1109/POLYTR.2001.973265

H. Schaefer, T. Gesang, A. Hartwig, H. Knaebel, U. Maurieschat, T. Riesenbeck

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引用次数: 1

摘要

“Adaptronics”科学领域将传感器和执行器效应与电子学相结合。配备自适应电子设备的组件应感知相关属性，并以智能方式进行适应——它们应“感觉、思考和行动”。例如，一个应用是动态应力结构的主动振动补偿。要展示的工作范围是制造具有低刚度和厚度的传感器/致动器微系统，以维持所使用的轻质材料的有利性能。为此，各种粘合剂和铸造材料在制造过程中起着不可或缺的作用。这种系统的微制造是弗劳恩霍夫研究所IFAM的一项活动。所选择的方法包括利用直径范围为20 /spl μ m-200 /spl μ m的压电纤维。纤维模块由许多由导电胶粘剂制成的交错电极连接的纤维组成。此外，还使用结构粘合剂和铸造聚合物。

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Polymeric materials for adaptronic fibre modules

The scientific field of "Adaptronics" combines sensor and actuator effects with electronics. The components furnished with adaptronics shall sense relevant properties and shall adapt in an intelligent way-they shall "feel, think and act". For instance, one application is the active vibration compensation of dynamically stressed structures. The scope of the work to be presented is to manufacture sensor/actuator microsystems with a low stiffness and thickness in order to sustain the favourable properties of the lightweight material used. In so doing, various adhesives and casting materials play an indispensable part in the manufacturing processes. The micro manufacturing of such systems is an activity of the Fraunhofer-Institute IFAM. The approach chosen includes the utilisation of piezo electric fibres in the diameter range from 20 /spl mu/m-200 /spl mu/m. The fibre modules consist of many fibres being contacted by interdigitated electrodes made of electrically conductive adhesives. In addition, structural adhesives and casting polymers are used.

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First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)

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