VDMOS源金属化老化对三维有限元线架建模的影响

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI:10.1109/ESIME.2011.5765828

E. Marcault, T. Azoui, P. Tounsi, M. Breil, A. Bourennane, P. Dupuy

{"title":"VDMOS源金属化老化对三维有限元线架建模的影响","authors":"E. Marcault, T. Azoui, P. Tounsi, M. Breil, A. Bourennane, P. Dupuy","doi":"10.1109/ESIME.2011.5765828","DOIUrl":null,"url":null,"abstract":"Based on 3D FEM electro-thermal simulations, we explore the thermal impact of source metallization ageing inducing a bonding wire lift off on a VDMOS device. This kind of failure is usually modeled by changing the geometry of the assembly[1][2], without considering the physical properties evolution of aged materials such as the source metallization [3]. This work aims to highlight the importance of taking into account material evolution due to ageing in 3D FEM electro-thermal simulations.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"281 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Impact of VDMOS source metallization ageing in 3D FEM wire lift off modeling\",\"authors\":\"E. Marcault, T. Azoui, P. Tounsi, M. Breil, A. Bourennane, P. Dupuy\",\"doi\":\"10.1109/ESIME.2011.5765828\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Based on 3D FEM electro-thermal simulations, we explore the thermal impact of source metallization ageing inducing a bonding wire lift off on a VDMOS device. This kind of failure is usually modeled by changing the geometry of the assembly[1][2], without considering the physical properties evolution of aged materials such as the source metallization [3]. This work aims to highlight the importance of taking into account material evolution due to ageing in 3D FEM electro-thermal simulations.\",\"PeriodicalId\":115489,\"journal\":{\"name\":\"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"volume\":\"281 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-04-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2011.5765828\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2011.5765828","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

基于三维有限元电热模拟，研究了源金属化老化对VDMOS器件键合线脱落的热影响。这种失效通常通过改变组件的几何形状来建模[1][2]，而不考虑老化材料的物理性质演变，如源金属化[3]。这项工作旨在强调在三维有限元电热模拟中考虑材料老化的重要性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Impact of VDMOS source metallization ageing in 3D FEM wire lift off modeling

Based on 3D FEM electro-thermal simulations, we explore the thermal impact of source metallization ageing inducing a bonding wire lift off on a VDMOS device. This kind of failure is usually modeled by changing the geometry of the assembly[1][2], without considering the physical properties evolution of aged materials such as the source metallization [3]. This work aims to highlight the importance of taking into account material evolution due to ageing in 3D FEM electro-thermal simulations.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

自引率

0.00%

发文量