高性能模拟电路的分层和分析放置技术

Biying Xu, Shaolan Li, Xiaoqing Xu, Nan Sun, D. Pan
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引用次数: 19

摘要

高性能模拟集成电路通常要求最小化临界寄生负载,这可以通过布局阶段的临界网线长度来建模。为了减少布局后电路性能的下降,除了传统的总面积和半周线长(HPWL)的优化目标外,在布局时还应考虑临界网线长度的最小化。在本文中,我们为高性能模拟电路的放置开发了有效的分层和分析技术,这是一个复杂的问题,因为它具有多目标和约束(例如分层对称群)。首先以自顶向下、临界寄生感知、分层对称约束和邻近约束可行的方式对整个电路进行分层划分,在合理的运行时间内求解每一层各分区的布局子问题。然后,利用现代多核系统并行化的计算能力,自下而上地为每个分区生成不同的放置变量。为了组合不同子分区的放置变量,提出了一种混合整数线性规划(MILP)公式,该公式可以同时最小化临界寄生负载、总面积和HPWL,并处理分层对称约束、模块变量选择和方向。实验结果证明了该方法的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hierarchical and Analytical Placement Techniques for High-Performance Analog Circuits
High-performance analog integrated circuits usually require minimizing critical parasitic loading, which can be modeled by the critical net wire length in the layout stage. In order to reduce post-layout circuit performance degradation, critical net wire length minimization should be considered during placement, in addition to the conventional optimization objectives of total area and half perimeter wire length (HPWL). In this paper, we develop effective hierarchical and analytical techniques for high-performance analog circuits placement, which is a complex problem given its multi-objectives and constraints (e.g. hierarchical symmetric groups). The entire circuit is first partitioned hierarchically in a top-down, critical parasitics aware, hierarchical symmetric constraints and proximity constraints feasible manner, where the placement subproblem for each partition at each level can be solved in reasonable run-time. Then, different placement variants are generated for each partition from bottom up, taking advantage of the computation power of modern multi-core systems with parallelization. To assemble the placement variants of different subpartitions, a Mixed Integer Linear Programming (MILP) formulation is proposed which can simultaneously minimize critical parasitic loading, total area and HPWL, and handle hierarchical symmetric constraints, module variants selection and orientation. Experimental results demonstrate the effectiveness of the proposed techniques.
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