{"title":"大功率LED灯泡的热分析。铝、陶瓷和不锈钢基板封装的比较","authors":"S. Tzanova, N. Kurtev","doi":"10.1109/ET.2019.8878320","DOIUrl":null,"url":null,"abstract":"In this paper, the thermal analysis of 3 different package-on-substrates for light emitting diode (LED) bulb is presented. The same aluminum heat sink was used for all simulations. The results are obtained using CFD simulation software.","PeriodicalId":306452,"journal":{"name":"2019 IEEE XXVIII International Scientific Conference Electronics (ET)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal Analysis of High Power LED Bulb. Comparison between Aluminum, Ceramic and Stainless Steel Package-On-Substrates\",\"authors\":\"S. Tzanova, N. Kurtev\",\"doi\":\"10.1109/ET.2019.8878320\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the thermal analysis of 3 different package-on-substrates for light emitting diode (LED) bulb is presented. The same aluminum heat sink was used for all simulations. The results are obtained using CFD simulation software.\",\"PeriodicalId\":306452,\"journal\":{\"name\":\"2019 IEEE XXVIII International Scientific Conference Electronics (ET)\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE XXVIII International Scientific Conference Electronics (ET)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ET.2019.8878320\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE XXVIII International Scientific Conference Electronics (ET)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ET.2019.8878320","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal Analysis of High Power LED Bulb. Comparison between Aluminum, Ceramic and Stainless Steel Package-On-Substrates
In this paper, the thermal analysis of 3 different package-on-substrates for light emitting diode (LED) bulb is presented. The same aluminum heat sink was used for all simulations. The results are obtained using CFD simulation software.
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