MEMS用二氧化硅薄膜的室温合成及硅表面变形

A. Ashok, P. Pal
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引用次数: 2

摘要

在本工作中,探索了室温沉积二氧化硅薄膜用于制造微机电系统(MEMS)元件和用于晶体硅太阳能电池的表面纹理。研究了氧化膜在不同温度、不同浓度的四甲基氢氧化铵(TMAH)和氢氧化钾(KOH)溶液中的腐蚀速率。在25 wt%的TAMH中,生长的氧化物被证明是用于制造各种MEMS元件的结构层和掩蔽层。此外,生长的氧化物在KOH中用作蚀刻掩膜,在不使用光刻的情况下使硅片表面纹理化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Room temperature synthesis of silicon dioxide thin films for MEMS and silicon surface texturing
In the present work, the room temperature deposited silicon dioxide thin films are explored for the fabrication of microelectromechanical systems (MEMS) components and the surface texturing for crystalline silicon solar cell applications. The etch rates of as-grown oxide films are investigated in different concentration tetramethylammonium hydroxide (TMAH) and potassium hydroxide (KOH) solutions at different temperatures. In 25 wt% TAMH, the as-grown oxide is demonstrated as structural and masking layers for the fabrication of various kinds of MEMS components. Furthermore, the as-grown oxide is exploited as etch mask in KOH to texturize silicon wafer surface without using lithography.
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