用于超高速逻辑电路的HT/sub /超导互连

IEEE Antennas and Propagation Society International Symposium 1992 Digest Pub Date : 1992-06-18 DOI:10.1109/APS.1992.221782

B. Cabon, T. Vu Dinh, J. Chilo

{"title":"用于超高速逻辑电路的HT/sub /超导互连","authors":"B. Cabon, T. Vu Dinh, J. Chilo","doi":"10.1109/APS.1992.221782","DOIUrl":null,"url":null,"abstract":"The authors present modeling results in frequency domain and experimental validation of superconductive transmission lines. SPICE simulations have demonstrated the advantages of using the high T/sub c/ superconductive interconnections for applications to fast logic circuits and their integration in multichip modules. Low losses of these materials allow novel devices to be studied (delay lines, devices with controlled dispersion, etc.).<<ETX>>","PeriodicalId":289865,"journal":{"name":"IEEE Antennas and Propagation Society International Symposium 1992 Digest","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"HT/sub c/ superconductive interconnections for ultra fast logic circuits\",\"authors\":\"B. Cabon, T. Vu Dinh, J. Chilo\",\"doi\":\"10.1109/APS.1992.221782\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors present modeling results in frequency domain and experimental validation of superconductive transmission lines. SPICE simulations have demonstrated the advantages of using the high T/sub c/ superconductive interconnections for applications to fast logic circuits and their integration in multichip modules. Low losses of these materials allow novel devices to be studied (delay lines, devices with controlled dispersion, etc.).<<ETX>>\",\"PeriodicalId\":289865,\"journal\":{\"name\":\"IEEE Antennas and Propagation Society International Symposium 1992 Digest\",\"volume\":\"10 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-06-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Antennas and Propagation Society International Symposium 1992 Digest\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APS.1992.221782\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Antennas and Propagation Society International Symposium 1992 Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APS.1992.221782","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

给出了超导传输线的频域建模结果和实验验证。SPICE模拟已经证明了将高T/sub /超导互连用于快速逻辑电路及其在多芯片模块中的集成的优势。这些材料的低损耗允许研究新的器件(延迟线，具有控制色散的器件等)。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

HT/sub c/ superconductive interconnections for ultra fast logic circuits

The authors present modeling results in frequency domain and experimental validation of superconductive transmission lines. SPICE simulations have demonstrated the advantages of using the high T/sub c/ superconductive interconnections for applications to fast logic circuits and their integration in multichip modules. Low losses of these materials allow novel devices to be studied (delay lines, devices with controlled dispersion, etc.).<>

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IEEE Antennas and Propagation Society International Symposium 1992 Digest

自引率

0.00%

发文量