基于多层液晶聚合物的39ghz 5G封装天线设计

Zhi-Xia Du, Bintao Tang, Chunbing Guo, Bo Sun, Shan-jia Xu, Gary Zhang
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引用次数: 0

摘要

提出了一种面向5G应用的毫米波多层封装天线设计方案。在基于液晶聚合物(LCP)的HDI堆叠封装中设计了贴片天线。一个腔位于多层LCP中以容纳RFIC模具。此外,天线通过采用平滑过渡的带状线匹配网络与RFIC芯片匹配。仿真结果表明,该封装天线在39 GHz时的反射系数为- 30 dB,轴向增益大于6.7 dBi。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 39 GHz Antenna-in-Package Deign Based on Multi-Layer Liquid-Crystal Polymer for 5G Applications
A millimeter-wave multi-layer antenna-in-package design is proposed for 5G applications. A patch antenna is designed in the package with HDI stack-up based on liquid-crystal polymer (LCP). A cavity is located in the multi-layer LCP to hold the RFIC die. Moreover, the antenna is matched to the RFIC die by employing a stripline matching network with smooth transition. Simulation results show that the antenna in package achieves a reflection coefficient of −30 dB and a boresight gain greater than 6.7 dBi at 39 GHz.
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